| abstract |
Disclosed is a method for manufacturing a metal oxide thin film transistor. According to the method, an active layer having a high carrier concentration is formed, and then a channel region is oxidized by plasma having oxidbillity so that the channel region has a low carrier concentration while a source region and a drain region have high carrier concentrations. In addition, the threshold voltage of the transistor is controlled by the conditions under which the channel region of the transistor is subsequently oxidized by plasma having oxidbillity at a low temperature. Therefore, the controllability of the characteristics of the transistor is improved significantly, and the manufacturing process is simplified. |