| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0848a5280b18bdb889b45b8fe5223834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bf83328d853bc7476ca10212837b3a01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a80097937d1d5a46a145fd688b68e22a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d075452b3a42fc5b6313a3bd3e9554fb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2011-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_966e98f16c201d5e42f793442df3905e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1c7c2fdbb6de2172db426d5cd0e4aa64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_887fc98a35dcfb2446abaa0e8cc51a66 |
| publicationDate |
2013-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2013119543-A1 |
| titleOfInvention |
Through silicon via for stacked wafer connections |
| abstract |
Stacked wafer connections are enhanced by forming a though silicon via including a first via portion formed in an upper portion of a via hole and a second via portion in a lower portion of the via hole. Embodiments include forming a via hole in a first surface of a substrate; partially filling the via hole with a dielectric material; filling the remainder of the via hole with a first conductive material; removing a portion of a second surface of the substrate to expose the dielectric material; removing the dielectric material from the via hole; and filling a the via hole with a second conductive material electrically conductively connected to the first conductive material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016148841-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8883638-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9553080-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9123702-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11756880-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9343364-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015147878-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9779992-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11557539-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9275935-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014061940-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8803292-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023272786-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10504776-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023121644-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9355935-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022147429-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10049965-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013183825-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104752323-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9620488-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8987137-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9613847-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012153492-A1 |
| priorityDate |
2011-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |