| abstract |
This disclosure provides systems, methods and apparatus for fabricating encapsulated devices, including electromechanical systems devices. In one aspect, a cover plate including one or more encapsulation lids releasably attached to a carrier substrate is provided. The one or more encapsulation lids can be joined to a device substrate to encapsulate one or more devices on the device substrate in a batch process. After joining, the encapsulation lids are released from the carrier substrate resulting in the formation of encapsulated devices on the device substrate. In another aspect, encapsulated devices are provided. |