| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_206afd9cd4e6ecc47c179ae622b1767d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d63a0403f7bdaf2ca8b93d936dd12a17
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_008d89f84b614c39d4b797876b164ffa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_10b66481c62e6c23863d211449448912 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2848
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24975
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-302 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-088
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-641
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00 |
| filingDate |
2012-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05eddcfbef2a1e65d2bf867476c73390
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_64e2b5be33338c64f4ecb7344a2531f4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_920250dcf9362643fe2c930534bc243c |
| publicationDate |
2013-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2013040120-A1 |
| titleOfInvention |
Thin metal substrate having high thermal conductivity |
| abstract |
A thin metal substrate having high thermal conductivity includes a copper foil layer, an insulating polymer layer and a thermal conductive adhesive layer. The thermal conductive adhesive layer has a resin and a thermal conductive powder dispersed in the resin. The insulating polymer layer is disposed between the copper foil layer and the thermal conductive adhesive layer. Since the thermal conductive adhesive layer has the thermal conductive powder and the insulating polymer layer has insulating and anti-breakdown abilities, the substrate has a reduced thickness, high heat dissipating efficiency and improved insulating performance. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103945641-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017245358-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9958008-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016290397-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113442527-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105280587-A |
| priorityDate |
2011-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |