| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d2af4fa54541ffebbf8d9c243383df60 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54413
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0275
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09936
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49175
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54406
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-5442
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1433 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K7-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C29-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-07732
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0268
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11C29-1201
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L22-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-26 |
| filingDate |
2012-10-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_148136cca57bf94f4dfb6b6bfe7ebec3 |
| publicationDate |
2013-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2013033284-A1 |
| titleOfInvention |
Disguising test pads in a semiconductor package |
| abstract |
A method of forming a semiconductor package is disclosed including disguising the test pads. Test pads are defined in the conductive pattern of the semiconductor package for allowing electrical test of the completed package. The test pads are formed in shapes such as letters or objects so that they are less recognizable as test pads. |
| priorityDate |
2007-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |