| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0895056eb0ad9c210c8c632fa22668d4 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2483-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1643
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1645
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1628
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1629
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-1646
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B41J2-161 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-30 |
| filingDate |
2012-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb948ee6e64a8064494413e920029dc5 |
| publicationDate |
2013-01-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2013001810-A1 |
| titleOfInvention |
Method of Manufacturing a Part of a MEMS System |
| abstract |
A method of manufacturing a bonded body of a semiconductor substrate and a semiconductor device to be mounted on the semiconductor substrate are provided. The method includes: preparing a first base member and a second base member; imparting liquid repellency for a liquid material to at least a part of a bonding film non-formation region of the first base member to form a liquid repellent region thereon; supplying the liquid material onto the first base member to selectively form a liquid coating on a bonding film formation region of the first base member; drying the liquid coating to obtain a bonding film on the bonding film formation region; and bonding the first base member and the second base member together through the bonding film due to a bonding property developed in a vicinity of a surface of the bonding film to thereby obtain the bonded body. |
| priorityDate |
2008-03-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |