| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f7fb8e9adad52abb74b28b5975feb57a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_aa62b9b820c8b7493fc97fb9d6768c2d |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| filingDate |
2011-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1101fcf8d30ddbc3562ca558ddb53353 |
| publicationDate |
2012-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012329279-A1 |
| titleOfInvention |
CMP Slurry/Method for Polishing Ruthenium and Other Films |
| abstract |
A method and associated composition for CMP processing of noble metal-containing substrates (such as ruthenium-containing substrates) afford both high removal rates of the noble metal and are tunable with respect to rate of noble metal removal in relation to removal of other films. Low levels of an oxidizing agent containing one or more peroxy-functional group(s) can be used along with a novel ligand to effectively polish noble metal substrates. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20160013814-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2014194016-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102371843-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9299585-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-4103663-A4 |
| priorityDate |
2010-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |