| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2e0dc06305136d411cb17c692f0cca00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ff95c7a65c262918b0d1fdab1f38899b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f80afcd35db55b0ddd4af0490bb5aee0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3f8f4d513c6c3be3e605db4aa71f264e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c82c505d0b35d419e8348dd2048de1a1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7813 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 |
| filingDate |
2011-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a3367392edb444ec753780f1a7d828d2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_87ae42035c4c5fae65a52d3b5c8757e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2835feb836b79071181618b9942d6d29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f6854565e1dffb5bc697d8b448e75e8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d6a64f480a74c98a49dede30db2ecf2 |
| publicationDate |
2012-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012322230-A1 |
| titleOfInvention |
Method for forming two device wafers from a single base substrate utilizing a controlled spalling process |
| abstract |
The present disclosure provides a method for forming two device wafers starting from a single base substrate. The method includes first providing a structure which includes a base substrate with device layers located on, or within, a topmost surface and a bottommost surface of the base substrate. The base substrate may have double side polished surfaces. The structure including the device layers is spalled in a region within the base substrate that is between the device layers. The spalling provides a first device wafer including a portion of the base substrate and one of the device layers, and a second device wafer including another portion of the base substrate and the other of the device layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8936961-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10170311-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9679772-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013316488-A1 |
| priorityDate |
2011-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |