| abstract |
A package structure including an electronic component 2 mounted on a circuit board 1 with a bonding metal 3 , wherein a flux 4 contains a compound having a hydroxyl group and remains on the surface of the bonding metal 3 , a coating resin 5 contains 10% to 50% by weight of isocyanate, and a reactant 8 of the coating resin 5 and the flux 4 is formed at an interface between the flux 4 and the coating resin 5 . Water resistance and moisture resistance can be obtained without cleaning the flux 4. The coating resin 5 can be easily peeled off at a temperature not lower than the glass transition point temperature of the flux 4. |