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filingDate 2011-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2012-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2012313190-A1
titleOfInvention Packaged device including interposer for increased adhesive thickness and method of attaching die to substrate
abstract A device includes a die having: at least one of an electronic device and a microelectromechanical system, a package substrate, an electrically nonconductive interposer disposed between the die and the package substrate, at least a first adhesive layer disposed between the package substrate and the electrically nonconductive interposer, and at least a second adhesive layer disposed between the die and the electrically nonconductive interposer.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014252594-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11787690-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014151717-A1
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