Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2b49a8871a43b458eff950072f427ffb http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_57747d47b6d37a90a640f927aa5e43bf http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6af9a57049d2d91c036d4f5ab49154cb http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4f6807b287bf5fd1f0d4d63ffef63bb9 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24917 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24942 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C28-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B3-00 |
filingDate |
2011-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cab5ad25981a3f1a566ac158b44cc53a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b5af2fad9f5f7790a013eee4b491fc3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2619d5cf717f576d25c12c8c8b2250ba |
publicationDate |
2012-11-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2012301688-A1 |
titleOfInvention |
Flexible electronics wiring |
abstract |
Devices are formed that combine low resistance for circuit needs with high flexibility for application needs. Embodiments include forming a low resistance layer on a substrate and forming a high flexibility conductive layer on the low resistance layer, wherein the high flexibility conductive layer provides for continuous conductivity of the low resistance layer. Embodiments include forming a pattern in the low resistance and high flexibility conductive layers simultaneously, or forming a pattern in the low resistance layer prior to forming the high flexibility conductive layer. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014290390-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8791455-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105810598-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102013214249-A1 |
priorityDate |
2011-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |