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filingDate 2012-01-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2012-11-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2012292092-A1
titleOfInvention Method of manufacturing circuit board and circuit board manufactured by the method
abstract A method of manufacturing a circuit board includes: providing a base substrate that comprises a first electrically conductive layer that has an inner circuit pattern formed on at least one surface of the base substrate; attaching a build-up material to the base substrate to insulate the first electrically conductive layer from outside; forming one or more holes at one time in the build-up material attached to the base substrate; forming a stack by curing the build-up material in which the one or more holes are formed; and forming a second electrically conductive layer that has an outer circuit pattern formed on at least one outer surface of the stack. The method may form the holes without drilling.
priorityDate 2011-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 28.