| abstract |
An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition ( 2 ) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board ( 1 ) in the form of a sheet. The manufacturing method also includes a temporary loading step of temporarily loading a semiconductor chip ( 3 ) and capacitors ( 4 a ) to ( 4 d ) on the epoxy resin composition ( 2 ) and an ultimate pressure bonding step of pressuring the semiconductor chip ( 3 ) and capacitors ( 4 a ) to ( 4 d ) by a thermal bonding head ( 20 ) in situ to ultimately pressure bond the semiconductor chip ( 3 ) and capacitors ( 4 a ) to ( 4 d ). |