| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_87d387fa991ccaade857121c44b965cf
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f33547fadddad9dee9fb65d2426da066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51c57da49bc881fbb18d66b758588b2a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3732 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-18 |
| filingDate |
2011-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9f820817eec3f2ea739938f590f40d8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_777b9607dbf0f425f67e9bed637c6dcb |
| publicationDate |
2012-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012280352-A1 |
| titleOfInvention |
Semiconductor structure with heat spreader and method of its manufacture |
| abstract |
A semiconductor structure is provided and a method for manufacturing said structure. The semiconductor structure includes a thin film semiconductor having an active region and placed on a diamond substrate. The thin film semiconductor is preferably directly bonded to the diamond layer, or may be adhered thereto by a dielectric adhesion. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11107685-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019362974-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015167181-A1 |
| priorityDate |
2010-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |