| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5bf3e6ad6789d40b1b093ca125558ea0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d34a345d1cfe9948425b594bf563c496
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2c8681581b8fc74bb15c8f41430db4b5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8554d4a7e6213e9544081e099d9dc3e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9e3841334f188f894b3899bf5a771654 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-2885
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-022 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25B15-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18 |
| filingDate |
2011-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c74f60e738d942c6bf69561d3135dd59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_52f370c726673e1f99adec3ea0c86348
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3c47eb61bdfab443631d298bd560601
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f52dd16e9568e4e075b5a586eaf43695
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09a2b13cb4b9fdd017bffdeb3f97f3c6 |
| publicationDate |
2012-11-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012279864-A1 |
| titleOfInvention |
Process for electroplating metals into microscopic recessed features |
| abstract |
Several techniques are described for reducing or mitigating the formation of seams and/or voids in electroplating the interior regions of microscopic recessed features. Cathodic polarization is used to mitigate the deleterious effects of introducing a substrate plated with a seed layer into an electroplating solution. Also described are diffusion-controlled electroplating techniques to provide for bottom-up filling of trenches and vias, avoiding thereby sidewalls growing together to create seams/voids. A preliminary plating step is also described that plates a thin film of conductor on the interior surfaces of features leading to adequate electrical conductivity to the feature bottom, facilitating bottom-up filling. |
| priorityDate |
1998-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |