| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2cf7f13d5f463d5ce3b86e2d3a1e7739
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_937cc52e8b5d1c2485da6c70025703e1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa5f0b70e3c6382f4f1e6747124a6660 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02372
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05548
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-483 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-60 |
| filingDate |
2012-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39ddcbfc29d69e50bd937d436170f1e5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_032cbf975d86e68fbb7a841dd344db91 |
| publicationDate |
2012-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012261697-A1 |
| titleOfInvention |
Wafer Level Packaging of Electronic Devices |
| abstract |
Aspects of the invention include an electronic device comprising a first contact point; a metal pad disposed to provide electrical connection to the first contact point; a substrate comprising a first face and a second face opposing the first face of the substrate, the first face of the substrate adjacent a face of the electronic device; and a VIA passing through the substrate from the second face of the substrate to the metal pad, the VIA exhibiting: a pass through extending through the substrate from the first face to the second face; a metal layer disposed within the pass through arranged to provide electrical connectivity to the metal pad from an area adjacent the second face of the substrate; and an electrically insulating first passivation layer disposed between the metal layer and the substrate arranged to provide electrical insulation between the substrate and the metal layer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9758876-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112909153-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016276532-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9656910-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015129919-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013277700-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11774233-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11011681-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10435796-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102013205847-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11078112-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10756003-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014147624-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11554984-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9346706-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11114309-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11062986-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9938186-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2019071323-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11001523-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10381524-B2 |
| priorityDate |
2009-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |