| abstract |
Semiaromatic, semicrystalline copolyamide molding compositions, comprising n A) from 35 to 100% by weight of a copolyamide composed ofn a 1 ) from 35 to 69% by weight of units which derive from hexamethylenediamine and from an aromatic dicarboxylic acid having from 8 to 16 carbon atoms, a 2 ) from 31 to 65% by weight of units which derive from 3,3′-dimethyl-4,4′-diaminodicyclohexylmethane and from terephthalic acid, a 3 ) from 0 to 30% by weight of units of a semicrystalline polyamide different from a 1 ) and a 2 ),n nB) from 0 to 65% by weight of further additives,n nwhere the total of the percentages by weight of A) and B) is 100%. |