http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012219918-A1

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filingDate 2011-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec96e844ae0c49c130d3d00ab823cdbe
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publicationDate 2012-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2012219918-A1
titleOfInvention Method for forming a wiring pattern by laser irradiation
abstract A method for forming a wiring pattern by laser irradiation includes the steps of coating a light-sensitive material on a substrate to form a light-sensitive layer, irradiating a laser beam on the light-sensitive material of the substrate to form a pattern including an exposed region exposed to laser irradiation and an unexposed region unexposed to laser irradiation, and forming a metallic wiring pattern by immersing the substrate into a solution having a plurality of metallic nano-particles. The metallic nano-particles are easily bonded to the straighter molecular structure of the light-sensitive material in the exposed region for forming a conducting wiring pattern. The laser irradiation method has advantages such as high-power, high-density, high-directionality and monochromaticity, such that product quality can be effectively controlled. Moreover, the laser irradiated light-sensitive material can form a molecular structure that is easily bonded to the metallic particles. As a result, the chemical wastes are substantially reduced.
priorityDate 2011-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 20.