| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_24958ba63d246d41be4ca15699e6ee96
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f07c8185dde020ca0dd8fda0ed06d69a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_418b23ba3ace927aa4c4d30ae324153a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5caf7f1e9d3837fc577f3e10edf354eb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13099
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01018
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0615 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-128 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50 |
| filingDate |
2009-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb5d68cfedac55357ed562b5b17159a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4c22d99c003d408b8a91a83b23ad3c94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_133c4b602b7d544d4b1bf48a155cd295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8538fe212464dab36a5bf2544e802b69 |
| publicationDate |
2012-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012217593-A1 |
| titleOfInvention |
Sensor mounted in flip-chip technology at a substrate edge |
| abstract |
The sensor assembly comprises a substrate ( 1 ), such as a flexible printed circuit board, and a sensor chip ( 2 ) flip-chip mounted to the substrate ( 1 ), with a first side ( 3 ) of the sensor chip ( 2 ) facing the substrate ( 1 ). A sensing area ( 4 ) and contact pads ( 5 ) are integrated on the first side ( 3 ) of the sensor chip ( 2 ). Underfill ( 18 ) and/or solder flux is arranged between the sensor chip ( 2 ) and the substrate ( 1 ). The sensor chip ( 2 ) extends over an edge ( 12 ) of the substrate ( 1 ), with the edge ( 12 ) of the substrate ( 1 ) extending between the contact pads ( 5 ) and the sensing area ( 4 ) over the whole sensor chip ( 2 ). A dam ( 16 ) can be provided along the edge ( 12 ) of the substrate ( 1 ) for even better separation of the underfill ( 18 ) and the sensing area ( 4 ). This de sign allows for a simple alignment of the sensor chip on the substrate ( 1 ) and prevents underfill ( 18 ) from covering the sensing area ( 4 ). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10107920-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8791532-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021111039-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11152226-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8736002-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016170032-A1 |
| priorityDate |
2009-11-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |