patent/US-2012205797-A1

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inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_81adf263d5eb353f243ba0299c0dbf87 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4b01cfa89f05f4d7ef46ef2d4c4fd9e2
publicationDate	2012-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2012205797-A1
titleOfInvention	Bump and semiconductor device having the same
abstract	A bump includes a metal pillar formed over a structural body; and a diffusion barrier member formed to cover at least a portion of a side surface of the metal pillar.
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type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009102037-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004087129-A1

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Total number of triples: 80.