| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7885331493dc4398ae2af8d715ec651d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_249a742bab62025c63fabe2d68fa9e92 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-167 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-36 |
| filingDate |
2012-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d888aa1a8402b0ced836f6841f09fd90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2a3583cc386f0429936203bfb0128c7 |
| publicationDate |
2012-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012205708-A1 |
| titleOfInvention |
Light-emitting device package and method of manufacturing the same |
| abstract |
A light-emitting device package. The light-emitting device package includes a lead frame comprising a plurality of separate leads; a molding member that fixes the plurality of leads and comprises an opening portion that exposes the lead frame; and a light-emitting device chip that is attached on the lead frame in the opening portion and emits light through an upper surface portion of the light-emitting device chip, wherein a height of the molding member is lower than a height of the light-emitting device chip with respect to the lead frame. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9865781-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11127672-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104752587-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104779335-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015280052-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9564564-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013299852-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8722435-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016181653-A |
| priorityDate |
2011-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |