| abstract |
[Object] n To provide a silicone resin composition for optical semiconductor devices, which has a low gas permeability and high dependability. n [Means for solution] n The silicone resin composition of the present invention contains the following components (A) through (D):n (A) an organopolysiloxane as shown in the following general formula (1) in which the number of alkenyl groups contained per one molecule is two or more nn (R 1 SiO 3/2 ) x (R 2 3 SiO 1/2 ) y (R 2 2 SiO 2/2 ) z (1)n n (wherein R 1 is a cycloalkyl group, R 2 is either one kind of or more than one kind of substituted or non-substituted monovalent hydrocarbon group having 1-10 carbon atoms, x is 0.5-0.9, y is 0.1-0.5, z is 0-0.2, and x+y+z=1.0),n (B) a hydrogen organopolysiloxane containing at least two SiH groups per one molecule, (C) a catalyst for addition reaction, (D) an adhesion promoter agent. |