Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_793261519dba59b0fab78c3ad3164b45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d40b82493df0fe0c51c1da1952184cd2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7aecc7ae05338a61320c024608463489 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81815 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-14515 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11912 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81193 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06537 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11462 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-0401 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05684 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81931 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1411 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05666 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13034 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0251 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H02H9-00 |
filingDate |
2011-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9205c68d789b462404ae7d78dffa1028 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7cbe8577ceb730b628a2dd980c018c6d |
publicationDate |
2012-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2012182651-A1 |
titleOfInvention |
Shared Electrostatic Discharge Protection For Integrated Circuits, Integrated Circuit Assemblies And Methods For Protecting Input/Output Circuits |
abstract |
A method for protecting input/output (I/O) circuits on an integrated circuit (IC) from electrostatic discharge (ESD) is disclosed. The method includes the steps of providing at least one protective device on a surface of a first semiconductor die and applying a conductive shorting layer over a select region of the surface to electrically couple at least one metallic stud to the at least one protective device. After bonding the IC die to a second IC die and/or testing one or more core circuits, the conductive shorting layer is removed to enable high-speed I/O connections arranged in the select region of the semiconductor die. An IC assembly includes first and second semiconductor dice. One of the dice includes a protective device along a surface. An electrically conductive shorting layer couples the protective device to a conductive element that is further coupled to I/O circuit elements. |
priorityDate |
2011-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |