| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d736905378b59bb55c6472cfcb871a73
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_44563b2721687138958a0d78c3fe8c55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9b9f95c0614576eb8fbfa9d07ef2eda6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_99b30ba1271668ea26717e821881370d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fcc0b66123940d1b32783569ebfa2d45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_33f4716ef421f67b004f771c2510e5f9 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00 |
| filingDate |
2012-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de62b8a50f6ffbee913e672c18d5c22e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_de78dc7fece8bb0c4215b1d49c3bb03e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5e7de478aa8d979d2e3536f2b03b0371
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a66d57487abecb66bca8dc90635a1db3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d03a360ebde4b534fdaaa0d6c681181 |
| publicationDate |
2012-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012171613-A1 |
| titleOfInvention |
Upper layer film-forming composition and method of forming photoresist pattern |
| abstract |
An upper layer film-forming composition includes a resin and a solvent component. The resin is soluble in a developer. The solvent component includes first solvent which has a boiling point of 180 to 280° C. at 101.3 kPa and a vapor pressure of 0.001 to 0.1 kPa at 20° C. The upper layer film-forming composition is used to form an upper layer film on a photoresist film. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015362835-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11249395-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9063425-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013115553-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9746768-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9458348-B2 |
| priorityDate |
2009-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |