Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7b695d597e7a96094946382798c84d4b http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_309e0060e29549efa872f9f7ca8aa855 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ac0f5a1101351363c582548a7536f313 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_745d211ad52747598bff89544458f857 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2b31f8612f522a744762d83c23879ba |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
2011-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_253221a3c0fe72a2b486865446b4cf9e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f27d794651fdc616a6a9638a4c318add http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e24d07bf38eb87802750cd781eae2e9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da2ccf794fc39b3b0cd849dad764870d |
publicationDate |
2012-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2012161326-A1 |
titleOfInvention |
Composition for filling through silicon via (tsv), tsv filling method and substrate including tsv plug formed of the composition |
abstract |
Provided is a composition for filling a Through Silicon Via (TSV) including: a metal powder; a solder powder; a curable resin; a reducing agent; and a curing agent. A TSV filling method using the composition and a substrate including a TSV plug formed of the composition are also provided. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102016102522-B4 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10258279-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10130302-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10413992-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021158241-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2731133-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10383572-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9861313-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9177929-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014342545-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104347548-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016297029-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11158519-B2 |
priorityDate |
2010-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |