| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1690d5e600f7c1884f7d07e0f2deef70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9c9aaea8e4d44dbe93ff2a7f9468943c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a492183be65153abfa7dec00d51c816
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3c88c141de752c5ae27f164a5eca7522 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-1094
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53276
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76898 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-41 |
| filingDate |
2010-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0442c206a1e76493eac136f5265e1629
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f408ba24d15b49660affceb739af6e9c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_450bbe04e79f34b1f95ab58d346e901e |
| publicationDate |
2012-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012074529-A1 |
| titleOfInvention |
Semiconductor package with through electrodes and method for manufacturing the same |
| abstract |
A semiconductor package may include a substrate with a first surface over which bond fingers are formed. At least two semiconductor chips may be stacked on the first surface of the substrate and each chip may have via holes. The semiconductor chips may be stacked such that the respective via holes expose the respective bond fingers of the substrate. Through electrodes may be formed in the via holes. The through electrodes may comprise carbon nanotubes grown from the exposed bond fingers of the substrate, where the through electrodes may be electrically connected with the semiconductor chips. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014284817-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9099459-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11069661-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104064486-A |
| priorityDate |
2010-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |