| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0b5d1b7723a39ce35001a44f16686449
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b5b0308506f9b9a6ef9e9bbd387c9a34 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31504
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-75
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-04 |
| filingDate |
2011-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_495e7e26f4a92f2e9bcb2c6b45fdef0f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e631ed3bc4b18b8d121c615084964ad0 |
| publicationDate |
2012-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012055015-A1 |
| titleOfInvention |
Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation |
| abstract |
The present invention relates to a method for manufacturing an electronic parts device allowing for easy overmolding and underfilling without requiring a jig for preventing leakage of the melted resin composition, and a resin composition sheet for electronic parts encapsulation used therein. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111108595-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10271426-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018084641-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018084640-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10271427-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020287518-A1 |
| priorityDate |
2010-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |