| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7d3729ea569034352bc584e7e6e4b3f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9a2d8b1ec1093ca641d04a1606bf0580
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b637f9f45afd69585579aa44456b785c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-388
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0179
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09554
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49158
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09609
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-135
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0582
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4608
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-481 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-4488
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2011-10-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19d15da742aae392756d37fc689f2085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a73ee2a267e6c062e3973c362a02115 |
| publicationDate |
2012-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012031655-A1 |
| titleOfInvention |
Multi-Layer Circuit Assembly And Process For Preparing The Same |
| abstract |
A process for fabricating a multi-layer circuit assembly is provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; (c) removing the dielectric coating in a predetermined pattern to expose sections of the substrate; (d) applying a layer of metal to all surfaces to form metallized vias through and/or to the electrically conductive core; (e) applying a resist to the metal layer to form a photosensitive layer thereon; (f) imaging resist in predetermined locations; (g) developing resist to uncover selected areas of the metal layer; and (h) etching uncovered areas of metal to form an electrical circuit pattern connected by the metallized vias. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015126026-A1 |
| priorityDate |
2001-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |