| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_52301f2cc2d08e5869ef76c9d7d0fd8f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0338
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G11B5-484
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-02 |
| filingDate |
2011-08-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3460ead64006f6dd322d9c4faf48be2 |
| publicationDate |
2012-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2012031648-A1 |
| titleOfInvention |
Wiring circuit board |
| abstract |
A wiring circuit board is provided, in which a circuit wiring is substantially free from a softening phenomenon which may otherwise occur due to heat over time, and is highly durable, less brittle and substantially free from cracking. The wiring circuit board includes a substrate comprising an insulative layer, and a circuit wiring provided on the insulative layer of the substrate. The circuit wiring has a layered structure including at least three copper-based metal layers. A lowermost one and an uppermost one of the copper-based metal layers each have a tensile resistance of 100 to 400 MPa at an ordinary temperature, and an intermediate copper-based metal layer present between the lowermost layer and the uppermost layer has a tensile resistance of 700 to 1500 MPa at the ordinary temperature. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8976538-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013056245-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015282314-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9713267-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9622344-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015107884-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11696401-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9461235-B2 |
| priorityDate |
2010-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |