| abstract |
A submount with an electrode layer having excellent wettability in soldering and method of manufacturing the same are disclosed. A submount ( 1 ) for having a semiconductor device mounted thereon comprises a submount substrate ( 2 ), a substrate protective layer ( 3 ) formed on a surface of the submount substrate ( 2 ), an electrode layer ( 4 ) formed on the substrate protective layer ( 3 ) and a solder layer ( 5 ) formed on the electrode layer ( 3 ) wherein the electrode layer ( 4 ) is made having an average surface roughness of less than 1 μm. The reduced average surface roughness of the electrode layer ( 4 ) improves wettability of the solder layer ( 5 ), allowing the solder layer ( 5 ) and a semiconductor device to be firmly bonded together without any flux therebetween. A submount ( 1 ) is thus obtained which with the semiconductor device mounted thereon is reduced in heat resistance, reducing its temperature rise and improving its performance and service life. |