| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9860de21c50c9fd671917f5b43ed5a3a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d2b6cb8c1bbbbaea87ca95d62fec6396
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_22609ce9c763b26a4742c2c4ee8d5903
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7b3e44b46e78c5e16630446c92331f8e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4835 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-58
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-74
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F11-1676
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-282
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 |
| filingDate |
2010-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2aa25b4a2cec1aa04528387a1fe66b2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed87992ee4095d32bce19d734012a788
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_152678853c47fc3c100bca402ce66469
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ba926a3d7cf226f6c25261c56b77d0c |
| publicationDate |
2011-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2011281124-A1 |
| titleOfInvention |
Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface |
| abstract |
Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019029830-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-112017007283-T5
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11121300-B2 |
| priorityDate |
2009-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |