Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1305 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15192 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01S5-02325 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04B10-503 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04B10-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04B10-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04B10-524 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04B10-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04B10-572 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04B10-564 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01S5-068 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04B10-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04B10-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04B10-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H04B10-54 |
filingDate |
2011-04-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e849dbc5d8128bb142993d87b3eeae5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44b5cccbc34afc11c4c7e42529cf5e4a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dae1187fc96c118e671171e5ab5a53ce |
publicationDate |
2011-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2011249980-A1 |
titleOfInvention |
Optical communication module and optical communication device |
abstract |
An optical communication module and an optical communication device including the same are provided. For example, a first semiconductor chip on which a laser diode is formed and a second semiconductor chip on which a laser diode driver circuit, etc. for subjecting the laser diode to drive by current are formed are mounted on a package printed circuit board to be close to each other. Temperature detecting means is further formed on the second semiconductor chip (laser diode driver circuit, etc.). The temperature detecting means detects a temperature variation ΔT of the first semiconductor chip (laser diode) transmitted via a wiring in the package printed circuit board and controls the magnitude of the driving current of the laser diode driver circuit based on a detection result. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10659169-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114137669-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019149240-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10587344-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022066108-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10914903-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11536919-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021024652-A1 |
priorityDate |
2010-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |