http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011244760-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6ac179bcbad17b8ea0260c65f201da92 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-0056 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-005 |
| filingDate | 2011-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3c0eafb8d1413bed40297955439887ab http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9e4a92975e96aac2e5a3e6af1bf3957b |
| publicationDate | 2011-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2011244760-A1 |
| titleOfInvention | Method for polishing a semiconductor wafer |
| abstract | A method of polishing a semiconductor wafer includes applying a polishing pad to the semiconductor wafer so as to subject the semiconductor wafer to a polishing process and supplying an aqueous polishing agent solution between the polishing pad and the semiconductor wafer. The polishing pad includes fixedly bonded abrasives of SiO 2 with an average grain size in a range of 0.1 to 1.0 μm. The aqueous polishing agent solution comprising an alkaline component, being free of solid materials and having a variable pH value in a range of 11 to 13.5. The aqueous polishing agent solution is maintained at a pH value of less than 13 during the polishing process and the pH value of the aqueous polishing agent solution is increased to a range of 13 to 13.5 so as to end the polishing process. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011244762-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8721390-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8882565-B2 |
| priorityDate | 2010-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.