| abstract |
Disclosed is an electronic component package 100 including a circuit board 10 , an electronic component 20 , and an adhesive layer 30 . The circuit board 10 is provided with an electrically-conductive conductor post 16 which is buried in a base member 12 , and a solder layer 18 which is provided at the front end 13 of the conductor post 16 while exposed from a surface 121 of the base member 12 . An electrode pad 24 having a metal layer 22 mounted thereon is provided on the main surface 26 of the electronic component 20 . The adhesive layer 30 contains a flux activating compound, and bonds the surface 121 of the base member 12 and the main surface 26 of the electronic component 20 . Then, the metal layer 22 and the solder layer 18 are metal-bonded. |