http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011212606-A1

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filingDate 2011-05-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1824f00a32e740807a246e592c4ad8eb
publicationDate 2011-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2011212606-A1
titleOfInvention Method of Fabricating Thin Film Transistor Structure
abstract A method of fabricating a thin film transistor (TFT) is provided. The method comprises the steps of providing a substrate with a gate electrode formed thereon; forming an insulating layer on the substrate and covering the gate electrode; forming an intrinsic amorphous silicon layer (intrinsic a-Si layer) on the insulating layer; forming an etch-stop layer on the intrinsic amorphous silicon layer, and the etch-stop layer positioned correspondingly to the gate electrode; treating the etch-stop layer to form an oxide layer, and the oxide layer covering the etch-stop layer; forming a n+ a-Si layer above the intrinsic amorphous silicon layer, and the n+ a-Si layer covering partial surface of the etch-stop layer and the oxide layer separating a sidewall of the etch-stop layer and the n+ a-Si layer; and forming a conductive layer on the n+ a-Si layer.
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priorityDate 2004-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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