| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_82a9e22a923eca64a02a97f0dfb493ed |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
| filingDate |
2010-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a5374b7bdcde9bde5d36d9cce15af11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cfd15f7575a955a53c61ffa81ac9c7f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b20f2473b4cd1e2f31e18a5e0b9a5748 |
| publicationDate |
2011-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2011204517-A1 |
| titleOfInvention |
Semiconductor Device with Vias Having More Than One Material |
| abstract |
A semiconductor die includes a via within a substrate material of the semiconductor die. The via includes a first conductive material having a first Coefficient of Thermal Expansion (CTE) and a second conductive material between the first conductive material and the substrate material of the semiconductor die. The second conductive material has a second CTE between the first CTE and a CTE of the substrate material of the semiconductor die. The first conductive material can be copper. The second conductive material can be tungsten and/or nickel. The substrate material can be silicon. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11387168-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2015020852-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9455220-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I670803-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017018492-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107980171-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8816505-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2013019541-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10886482-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9659858-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105612610-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9922875-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10083893-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10283449-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105814670-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11011420-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020106031-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10056322-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9099442-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9214425-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9466569-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10014257-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I618675-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10546777-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102013204337-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013015504-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9754825-B2 |
| priorityDate |
2010-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |