| abstract |
The present invention is to provide a prepreg capable of significantly decreasing generation of voids in a glass fiber base material and forming a printed wiring board and a semiconductor having high reliability, a laminate thereof, and a printed wiring board and a semiconductor device using the same. A prepreg comprising a glass fiber base material (A) impregnated with a thermosetting resin composition (B), wherein an inorganic particle having an average particle diameter of 500 nm or less is attached on a glass fiber surface of the glass fiber base material (A). |