http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011177292-A1

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inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_036d19399956d0d3efe197f6ebab668d
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publicationDate 2011-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2011177292-A1
titleOfInvention Ceramic assembled board, method of manufacturing the same, ceramic substrate and ceramic circuit substrate
abstract A ceramic assembled board shows an advantageous dividablility of allowing the board to be divided when intended and not allowing it to be divided with ease when unintended. A ceramic substrate shows an excellent degree of dimensional precision and bending strength. A ceramic circuit substrate shows a high dielectric strength. A ceramic assembled board is formed by cutting continuous dividing grooves on one or both of the surfaces of a sintered ceramic board by way of laser machining to produce a large number of circuit substrates and at least one of the continuous grooves has a largest depth section and a smallest depth section with a depth difference Δd of 10 μm ≦Δd≦50 μm. A ceramic substrate is produced by dividing the ceramic assembled board and at least one of its lateral surfaces is a surface formed by dividing the ceramic assembled board along the continuous grooves, the arithmetic mean roughness Ra2 of the machined surfaces of the continuous grooves being smaller than the arithmetic mean roughness Ra1 of the surfaces of broken sections with regard to the arithmetic mean roughness Ra of the lateral surfaces.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9474146-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11121048-B1
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Total number of triples: 49.