http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011175018-A1

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filingDate 2011-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cf999fc560beea3dcc30c788434525bf
publicationDate 2011-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2011175018-A1
titleOfInvention Polishing liquid and polishing method
abstract The present invention relates to a polishing slurry including: a colloidal silica having an average particle size of 40 nm or more; water; and a ζ potential adjusting component, in which (1) the ζ potential adjusting component includes at least one sodium salt selected from the group consisting of sodium nitrate and sodium sulfate, and the polishing slurry has a pH of 8 or more, or (2) the ζ potential adjusting component includes at least one water-soluble organic polymer selected from the group consisting of a water-soluble polyether polyamine and a water-soluble polyalkylene polyamine and at least one acid selected from the group consisting of hydrochloric acid, sulfuric acid, nitric acid, nitrous acid and amidosulfuric acid, and the ζ potential adjusting component contains the acid at a ratio of from 0.6 to 1.4 to the water-soluble organic polymer in terms of molar ratio, and the polishing slurry has a pH of 8 or more.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013149941-A1
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