| abstract |
To provide an electrodeposited copper foil having flexibility and bending property equivalent to or better than that of rolled copper foil, an electrodeposited copper foil wherein regarding a crystal structure after heat treatment is applied to the electrodeposited copper foil wherein LMP defined as formula 1 is 9000 or more, either color tone of a red system or a blue system occupies 80% or more in a surface in the EBSP analysis is provided. n LMP=( T +273)*(20+Log t ) Formula 1n wherein 20 is a material constant of copper, T is temperature (° C.), and t is time (Hr). nn Preferably, relative intensity of (331) face against (111) face is 15 or more in the X-ray diffraction of the electrodeposited copper foil after the heat treatment is applied to the electrodeposited copper foil. |