| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73ebc284a55d5daf0e209d6186c9e65c |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0709
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1173 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4867
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4664 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D1-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D1-38 |
| filingDate |
2010-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b305b51116412fe8d16376edb788029c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19b9f6dc4df84accb9a0bef9e0c47faa |
| publicationDate |
2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2011159207-A1 |
| titleOfInvention |
Method for producing build-up substrate |
| abstract |
A method for producing a build-up substrate containing two layers of wiring patterns that are separated from each other with an insulating film intervening therebetween and are electrically connected to each other at a contact part penetrating through the insulating film, includes: ejecting a liquid repelling agent having repellency to an ink for forming the insulating film from a liquid droplet ejecting head onto one of the wiring patterns, thereby forming a liquid repelling part; then ejecting the ink for forming the insulating film from a liquid droplet ejecting head onto portions on the wiring pattern except for the liquid repelling part provided, thereby forming the insulating film; then removing the liquid repelling part; and then forming the contact part and the other of the wiring patterns by electroless plating. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11284521-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2017003789-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3317753-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10026624-B2 |
| priorityDate |
2009-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |