| abstract |
A semiconductor device achieving both electromagnetic wave shielding property and reliability in a heating process upon mounting electronic components. In the semiconductor device, mount devices 5 and 6 mounted on a main surface of a circuit board 1 are provided, the mount devices 5 and 6 are electrically connected to a wiring pattern 4 at the main surface of the circuit board 1 , a sealant 7 of an insulating resin is formed to seal the mount devices 5 and 6 , metal particles are applied to a surface of the sealant 7 , and the metal particles applied are sintered, thereby forming an electromagnetic shielding layer 2 , and electrically connecting the electromagnetic shielding layer 2 to a ground pattern 3 of the circuit board 1. |