Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bfe9ced98a6ba0743c2f18d041c04dbe http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b9eb8bee99ca0c1560227109da8ad4c3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_81e77e0018a3030bc1c68ba4c94846ce |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4682 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0215 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49826 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0156 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-104 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49124 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-53265 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0097 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23P17-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23P19-00 |
filingDate |
2010-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_555f4fa27e51f1b4e3bd075c1921666d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39317a3fae178f4dd04216e6d5b0163e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92e41987b25c208f4a7b05b490cd3979 |
publicationDate |
2011-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2011138615-A1 |
titleOfInvention |
Carrier for manufacturing printed circuit board and method of manufacturing the same and method of manufacturing printed circuit board using the same |
abstract |
Disclosed herein is a carrier for manufacturing a printed circuit board, including: a magnetic sheet; and a metal layer attached to at least one side of the magnetic sheet by magnetic properties of the magnetic sheet. The carrier is advantageous in that its structure can be simplified without performing a vacuum or releasing process at the time of the attachment and separation of the carrier, thus reducing process cost and process time and maintaining the size of a printed circuit board. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8883016-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112074103-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109152226-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9507390-B2 |
priorityDate |
2009-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |