| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b01607e705336d4c0de8b9ac5f932497 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-361
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R13-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1089
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G2650-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L47-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2666-22 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J171-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R4-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R4-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K13-00 |
| filingDate |
2008-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d589f724980f0b6f00c89db761669c79
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4ab32f5caa80e99413b1218ed65bf7ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4fb4e06d5eb16dd14aad32baefaae47 |
| publicationDate |
2011-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2011120767-A1 |
| titleOfInvention |
Anisotropic electrically conductive film and method for manufacturing connection assembly using the same |
| abstract |
An anisotropic conductive film that may give rise to high connection reliability, and a method for manufacturing a connection assembly with the use of the anisotropic conductive film, are disclosed. An anisotropic conductive film ( 2 ) is composes of an insulating adhesive resin containing polybutadiene particles, a cationic polymerizable resin and a cationic curing agent, and conductive particles dispersed in the insulating adhesive resin, with the lowest melt viscosity of the anisotropic conductive film being 300 to 1000 Pa·s. This anisotropic conductive film is placed in contact with terminal electrodes of a glass substrate ( 1 ). A flexible printed circuit board ( 3 ) is placed on top of the anisotropic conductive film so that terminal electrodes of the flexible printed circuit board ( 3 ) are in contact with the anisotropic conductive film ( 2 ). A heating tool is thrust onto the flexible printed circuit board side for electrically interconnecting the terminal electrodes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9666552-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11541477-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10189781-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2013154129-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3086411-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7340931-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2020529118-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014124931-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9540549-B2 |
| priorityDate |
2007-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |