| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1e8724e7697af9d12716c12155af1212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_12ab92ffcd12a59f6987805a68dd27d5 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49861
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-15
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4985 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-30 |
| filingDate |
2009-06-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4691c4a89c1754cfd1be03db635875a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7844267134a0b2bbad9221d0ae285b9 |
| publicationDate |
2011-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2011107594-A1 |
| titleOfInvention |
Planar electrical power electronic modules for high-temperature applications, and corresponding production methods |
| abstract |
With respect to an electronic component, in particular a power module, and in a corresponding method for producing or contact-connecting said component, the component ( 1 ) is fastened to an electrically insulating carrier film ( 3 ) having at least one first inorganic material and at least one opening ( 5 ) in which at least one electrical contact-connection ( 7 ) of the component ( 1 ) to outside the component ( 1 ) is provided. This makes it possible to provide electronic components ( 1 ), in particular power modules, for a temperature range of >175 DEG C. |
| priorityDate |
2008-07-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |