http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011101411-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b7317808024e524eea40a6c5a5ad6a22 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10962 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09836 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2115-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09754 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09063 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3494 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21K9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21V21-00 |
| filingDate | 2009-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc246c3bfacf581383384420745e0b21 |
| publicationDate | 2011-05-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2011101411-A1 |
| titleOfInvention | Support module for a solid state light source, a lighting device comprising such a module, and a method for manufacturing such a lighting device |
| abstract | A support module ( 1 ), comprising a conducting layer ( 2 ) having a trough hole ( 5 ) and a receiving surface adapted to receive a solid state light source ( 3 ) with the electrical contact pad ( 4 ) being aligned with the through hole ( 5 ). The support module ( 1 ) further comprises an electrical insulation element ( 8 ) and at least one contact pin ( 9 ), extending through the electrical insulation element ( 8 ), and protruding through the through hole ( 5 ). Furthermore, the electrical insulation element ( 8 ) comprises a channel ( 10 ) allowing access to the end of the contact pin ( 9 ) and the electrical contact pad ( 4 ) of the solid state light source ( 3 ) received by the surface of the conducting layer ( 2 ). Such a channel makes it possible to reach the end of the contact pin and the contact pad through the insulation element with a soldering tool. Thus, it is possible to attach the solid state light source on a metal surface by soldering the contact pin to the contact pad. Mounting a solid state lighting device on a metal surface is advantageous in applications requiring good heat dissipation, since the heat dissipation properties of a metal surface is better than of a printed circuit board. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/RU-2474985-C1 |
| priorityDate | 2008-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.