| abstract |
A composite material for an electrical/electronic part, which is used as a material for use in an electrical/electronic part formed by punching process, containing a metal base material of, for example, a copper-type metal material and a substantially one layer of an insulating film provided on at least a part of the metal base material, in which a metal layer formed of Ni or a Ni—Zn alloy is interposed between said metal base material and said insulating film, such that the peel width of said insulating film at the end of the material obtained after said punching process, is less than 10 μm. |