http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011073242-A1

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filingDate 2010-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ab89d0c5c178669f36c7e86c1d7a51b
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publicationDate 2011-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2011073242-A1
titleOfInvention Production process for surface-mounting ceramic led package, surface-mounting ceramic led package produced by said production process, and mold for producing said package
abstract The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate.
priorityDate 2008-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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