| abstract |
An electrostatic chuck 10 includes an electrostatic electrode 14 embedded in a ceramic base 12 having a wafer-supporting surface 12 a capable of holding a wafer W, the electrostatic electrode 14 being parallel to the wafer-supporting surface 12 a . The ceramic base 12 is composed of a dense ceramic having a MgO content of 99% by weight or more. The electrostatic electrode 14 is a disc-like electrode composed of, for example, at least one metal selected from the group consisting of Ni, Co, and Fe. The electrostatic electrode 14 includes a conductive tablet 16 connected to the center thereof. The tablet 16 is exposed at the bottom of a counter-bored hole 18 formed so as to reach the tablet 16 from a back surface 12 b of the ceramic base 12 , and is connected to a feeding terminal 20 , composed of Ni, inserted into the counter-bored hole 18. |