http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011052937-A1

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filingDate 2009-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_756992240cfe95978f44c4323c9a8e40
publicationDate 2011-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2011052937-A1
titleOfInvention Copper-zinc alloy electroplating bath and plating method using the same
abstract Disclosed is a cyanide-free copper-zinc alloy electroplating bath which can form a uniform and glossy plated layer having the desired composition in a large current density range, and a plating method using the same. n The copper zinc alloy electroplating bath contains a copper salt, a zinc salt, an alkali metal pyrophosphate or an alkali metal tartrate, and nitrate ions. The concentration of the nitrate ions is preferably 0.001 to 0.050 mol/L. Further, the pH of the copper-zinc alloy electroplating bath is preferably in the range of 8 to 14. Furthermore, in addition to the copper salt, the zinc salt, the alkali metal pyrophosphate and the nitrate ions, at least one selected from amino acids or salts thereof is preferably included, and histidine can be used favorably as the amino acid.
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priorityDate 2008-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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